Plastic enclosure for the TitanSBC-8Mmini is produced using 3D printing (FDM) with colored PLA filaments. The plastic enclosure for the TitanSBC-8Mmini includes ventilation openings, cutouts for interface connectors, and breakable caps for camera cables, GPIO, PCIe, etc. Standard color options are red and black (as shown).

The set includes two components forming the enclosure, screws for fastening them, and self-adhesive silicone bumpons.

On request, enclosures can be manufactured in other colors with a minimum order quantity (MOQ) of 50 sets. Upon request and subject to approval, 3D enclosure models are provided in STEP/STL format for in-house printing.

The YDM2006C05F Micro Fan is compact fan designed for use with heatsinks from our product range. It is characterized by small size (20x20x6 mm), low power consumption, high cooling efficiency, and reduced noise emission.

The YDM2006C05F Micro Fan is compatible with SomLabs’ heatsinks dedicated to System-on-Modules equipeed with multimedia NXP processors, specially: SpaceSOM-8Mplus and VisionSOM-8Mmini.

The YDM2006C05F Micro Fan is compatible with desicated heatsinks: SL-HEATSINK-50x20x10-A and SL-HEATSINK-85x40x10-A.

The YDM2006C05F Micro Fan featrues reliable construction with glass fiber reinforced plastic frame and is equipped with cycles-seal bearing. Operating temperature range is -10 °C to +70 °C, typical airflow: ~0.55 CFM (at 5 VDC), rotation speed 10000 rpm and noise level ≤ 18 dBA (typical).

The SL-HEATSINK-85x40x10-AR is aluminium, extruded industrial heatsink for SoM produced by SoMLabs. The SL-HEATSINK-85x40x10-AR is compact and lightweight aluminum heatsink for embedded passive cooling systems, offering high efficiency with low thermal resistance and large heat dissipation surface.

The 3D model of SL-HEATSINK-85x40x10-AR heatsink is now seamlessly integrated into the SOM module libraries and also available as a downloadable STEP file for easy design integration.

SL-MIPI-DSI-eDP-CNV is flexible DSI2eDP display converter. It converts MIPI-DSI to eDP protocol. The solution we dedicate to SoMLabs carrier boards equipped with MIPI-DSI interface (with FPC30 connector) but can be used in any MCU/MPU system. Converter is fully compliant with DSI1.1 and eDP 1.4 and converts video stream up to 60 fps 4K 4096 × 2304 resolution at 18 bpp color, and WUXGA 1920 × 1200 resolution with 3D graphics at 60 fps (120 fps equivalent).

The SL-MIPI-DSI-eDP-CNV based on SN65DSI86 bridge and is suported by Linux dedicated to SoMLabs SoM modules.

The SL-IoT-BOX-6ULL is a industrial fanless computer. It is compact, energy-efficient computer dedicated for edge and PLC applications.

Powered by the NXP i.MX6ULL processor, it offers versatile connectivity with RS232, RS485, CAN-FD, USB, Ethernet, and optional WiFi/BLE with external antenna. It provides digital and relay I/O, expandable storage via eMMC or MicroSD, as well as development-friendly features like LED indicators, a console port, and RTC with battery backup.

Designed for reliability and flexibility, the SL-IoT-BOX-6ULL industrial fanless computer is an ideal platform for modern IoT and industrial solutions. By integrating OpenPLC software, industrial applications become more scalable, future-ready, and performance-driven.

At the core of the system, the powerful VisionSOM-6ULL module drives the performance of the computer.

The SL-IoT-BOX industrial fanless edge computer comes in a durable aluminum enclosure, rated IP40 for reliable protection.

The SL-HEATSINK-12x12x8 is the extruded aluminium heatsink, dedicated to SoM produced by SoMLabs. The heatsink is attached to the module with self-adhesive, thermocoductive tape (as shown on picture below).

The SL-HEATSINK-15x15x15 is the extruded aluminium heatsink, dedicated to SoM produced by SoMLabs. The heatsink is attached to the module with self-adhesive, thermocoductive tape (as shown on picture below).

The SL-HEATSINK-60x20x10-A is the extruded aluminium heatsink, dedicated to SoM produced by SoMLabs. The heatsink is attached to the module with self-adhesive, thermocoductive tape (as on picture below).

StarCB-STM32H757-STD – carrier board for the dual-core StarSOM-STM32H757 family of computer-on-modules which are powered by  dual-core microcontroller (ARM Cortex-M7 + Cortex-M4). A carrier board, together with a System on Module (SoM), makes a complete development platform similar to SBC. The carrier board houses the most common interfaces such as USB, Ethernet, etc. A large variety of interfaces allows to use it as both a complete development platform or as a stand-alone end-product.

The carrier board connects with the SoM via a board-to-board, low profile connectors.

SpaceCB-8Mplus-ADV is advanced carrier board for the SpaceSOM-8Mplus family of computer-on-modules equipped with Neural Processing Unit (AI/Machine Learning applications). A carrier board, together with a System on Module (SoM), makes a complete development platform similar to SBC. The carrier board houses the most common interfaces such as USB 3.0, Ethernet, PCIe 3.0 (M.2), RS485, CAN FD, HDMI, LVDS, MIPI-DSI, MIPI-CSI, audio codec, etc. A large variety of interfaces allows to use it as both a complete development platform or as a stand-alone end-product.

The carrier board connects with the SoM via a standard SODIMM connector.

SpaceCB-8Mplus-ADV carrier board is equipped with  Segger J-Link debugger and Linux serial console port on USB vCOM.