VisionSOM-V2L (SLS22)
Renesas RZ/V2L ARM Cortex-A55 dual core and Cortex-M33 industrial SoM computer equipped with AI accelerator

The VisionSOM-V2L family comprises SODIMM-sized System-on-Modules based on the Renesas RZ/V2L application processor. The processor features a heterogeneous architecture combining two Arm Cortex-A55 application cores with an Arm Cortex-M33 real-time core. It also integrates a Mali-G31 3D Graphics Processing Unit based on the Bifrost architecture, with support for OpenGL ES 3.2, as well as a hardware video codec supporting H.264 encoding and decoding at resolutions of up to Full HD 1080p30.

The Renesas RZ/V2L is also equipped with the proprietary DRP-AI vision and artificial-intelligence accelerator, which combines a Dynamically Reconfigurable Processor with dedicated AI Multiply-Accumulate hardware. The DRP-AI accelerator supports both real-time AI inference and image processing functions required for camera-based applications, including colour correction and noise reduction. This enables the implementation of AI-powered vision applications without requiring an external Image Signal Processor.

The dual-core Cortex-A55 cluster, combined with the Cortex-M33 core, provides the flexibility required to run Linux and advanced HMI applications alongside real-time workloads.

The VisionSOM-V2L is a highly integrated, general-purpose System-on-Module offering high computing, multimedia and AI-processing performance. An optional, fully certified wireless module provides Wi-Fi connectivity compliant with IEEE 802.11b/g/n and Bluetooth Low Energy 5.1. This option simplifies carrier-board design and makes the module particularly suitable for connected and wireless applications.

The VisionSOM-V2L is available in various memory configurations, including a flexible range of DDR4 memory and eMMC flash capacities.

The VisionSOM-V2L provides the following key features and interfaces:

• an integrated DRP-AI hardware accelerator for AI inference and image processing;
• two high-speed USB On-The-Go interfaces with integrated PHYs;
• two 10/100/1000 Mb/s Ethernet interfaces;
• two CAN FD interfaces;
• digital audio interfaces;
• Full HD display support with 3D graphics acceleration and hardware H.264 encoding and decoding;
• touch-panel interfaces;
• a wide range of standard serial interfaces.

The module is suitable for industrial-grade embedded applications requiring high processing performance, real-time operation, advanced graphics, multimedia capabilities and AI-based image processing.